It is worth noting, has found that the auto-detection technology to the limited printed circuit board assembly test can not find all the defects. Therefore, the manual method of visual inspection and automated detection methods must be used in combination, especially for those small number of applications and even more so. X-ray inspection and manual optical inspection is to test the combination of best practices assembled plate defects.
1) components missing;
2) component failure;
3) there is misalignment components, misalignment;
4) component failure;
5) Bad soldering;
6) bridge;
7) insufficient solder;
8) over the formation of solder balls;
9) the formation of weld porosity (air bubbles);
10) contaminants;
11) improper pad;
12) wrong polarity;
13) pin float;
14) pin out too long;
15) appears cold solder joints;
16), excessive solder;
17) solder voids;
18) have blown holes;
19) printed line structure of the inner circle bad fillet.