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LED display unit PCB design rules 2
Last Updated : 2011/6/16

(4) the requirements of ground

Digital part of the ground lines width> = 50mil.

Part of the column drivers should be better than line-driven ground power line width, the proposed power line for the more than 1.5 times the width.

Unit board ground cloth should be shaped into a board, the connectivity between the various branches.

Copper to drive part of the shop, the digital part of the grid to shop. Land and other parts of the distance to 20mil or more. Grid to the width of 25mil, center spacing of 40mil.

Paving should be no loop to avoid dead ends. Paving is completed, will be separated to each part connected with manual floor.

Simulation in power to put the entrance test to pin.

Figures in the input pin, output pin and place the test in the middle of 9702 pins.

(5) capacitance requirements

In the drive section and the digital part of the power inlet, put 100u electrolytic capacitor and capacitor 104.

Branch in the power cord entrance and the end of the place, put the 100u electrolytic capacitors.

Recommended to stay near the line driver chip 100u electrolytic capacitor.

Series switch and driver IC power supply pin and ground to stay between 104 capacitor.

(6) chip power pin outlet

Series switch and chip line driver IC power pins and pin pad outlet at least as wide.

(7) column lines and signal lines:

Room shielding of the light board, the column line and signal line width> = 12mil. In the PCB size is large, the proposed signal line width 15mil.

Other recommendations are occasions line and signal line width of 12mil, at least 10mil.

Line spacing is not less than the minimum line width.

(8) via:

Room shielding of the light board, through a hole 50 mil, 28 mil.

Other occasions advised of a hole 50 mil, 28 mil. At least 40 mil, 24mil.

Vias and line spacing is not less than the minimum line width.

Power lines had the hole diameter <Power line width, power lines had the hole diameter> = power line width * 1 / 3. Recommended hole diameter: 28mil, 40mil.

Large power and ground vias can increase the number.

In order to ensure the welding, the hole should not be placed on the pad. From the pad at least 5mil.

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